Download Executive Brief

是否想从 3D Systems 接收特别优惠、产品更新和最新资讯?单击“是”,即表明您同意接收来自 3D Systems 或我们合作伙伴的后续电子邮件或电话通讯。您也可以选择随时取消接收通讯。请单击此处查看我们的隐私政策单击此处管理您的首选项

本网站受 reCAPTCHA 保护。Google 隐私政策服务条款适用。

Semiconductor Short Video

Read this executive brief to see how semiconductor capital equipment manufacturers can integrate metal AM into their manufacturing processes to rapidly deliver optimized precision components that maximize the performance, quality, yield, and reliability of their equipment.

With over two decades of semiconductor and additive manufacturing experience, 3D Systems will help you quickly adopt metal AM technology, giving you the control you need to produce high-performing, optimized parts.

We can help enable your AM capabilities across several key applications, such as:

  • Manifold and Tubing Flow Optimization: Maximize fluid and gas flow efficiency
  • Wafer Table Thermal Management: Optimize for thermal efficiency and performance
  • Flexure and Structural Optimization: Improve yield with lighter, consolidated parts

Download our executive brief to learn more about the benefits of metal AM and how we can accelerate your adoption.